Ciber SLasHДа в принципе вы и правы не хотелось переходить на личности, но в место того чтобы скачать архив и просмотрев его увидеть присутствующие, может быть частично, аббревиатуры в принципиальных схемах, происходит другое...
По этому следующий архив выкладывать нет смысла, его нужно печатать, чтобы увидеть хоть какую нибудь информацию от участников форума, а не бессмысленное набивание постов вместо этого.
И думаю что этот список соответствует заявленной теме
Аббревиатуры полупроводников:
[spoil]3GIO Third Generation I/O (input/output)
AMDP Advanced Multimedia Display Processor
APD Avalanche Photodiode
APDP anti-parallel diode pair
ASSP application specific standard product
BBD bucket brigade device
BBUL Bumpless Build-UP Layer
BGA ball grid array
Bi-CMOS bipolar-complementary metal oxide semiconductor
Bi-FET bipolar-FET
BJT bipolar junction transistor
BLM Ball Limiting Metal
BOX buried oxide
BQFP quad flat package with bumper
C-4 controlled collapse chip connection
CBA Cell Based Array
CCD charge coupled device
CC-NUMA cache coherent non-uniform memory access model
CF Compact Flash
CHMOS complementary high-performance MOS
CID charge injection device
CLB configurable logic block
CLCC ceramic leaded chip carrier
CMD charge modulation device
CMOS complementary metal oxide semiconductor
CMR Colossal magnetoresistive
COB chip on board
COF Chip ON Film
COT customer on the tooling
CPGA Ceramic Pin Grid Array
CPLD complex programmable logic device
CSD charge sweep device
CSNC compossible Synapse Weight Newton Calculation
CSP chip scale package
CZP circular zone plate
DCFL drain coupled FET logic
DDR double data rate
DFP dual flat package
DHBT double heterojunction bipolar transistor
DIMM dual in-line memory module
DINOR divided bit-line NOR
DIP dual in-line package
DLP Digital Light Processing
DMD digital micromirror device
DMOS double diffusion metal oxide semiconductor
DPAK Discrete Packaging
DRAM dynamic random access memory
DRCG Direct Rambus Clock Generator
DTCP dual tape carrier package
DTP dual tape carrier package
EBDW e-beam direct write
ECL emitter coupled logic
EEPROM electrically erasable and programmable read only memory(E2PROM)
ESBGA Enhanced Super Ball-Grid Array
EPL electron-projection lithography
EPLD erasable PLD
EPROM erasable and programmable read only memory
FACT Fairchild Advanced CMOS TTL
FAST Fairchild advanced Schottky TTL
FBGA fine-pitch ball grid array
FCBGA flip chip ball grid array
FCRAM Fast Cycle RAM
FeRAM ferroelectric programmable read only memory
FET field effect transistor
FFS Flash File System
FGA Fixed Gain amplifier
FIFO first-in first-out
FLGA fine pitch land grid array
FLP flat lead package
FP flat package
FPGA field programmable gate array large scale PLD
FPIC Field Programmable Interconnect Component
FPM Fast Page Mode
FQFP fine pitch quad flat package
FRAM Ferroelectrics random access memory
FTL Flash Translation Layer
GLA graphical logic array
GQFP quad flat package with guard ring
GRAM graphics random access memory
GSI giant scale integration
GTL Gunning transceiver logic
GTO gate turn-off thyristor
HAD Hole-Accumulation Diode
HBT heterojunction bipolar transistor
HCMOS high performance complementary metal oxide semiconductor
HEL high energy laser
HEMT high electron mobility transistor
HJFT heterojunction FET
HPL high power laser
HSOP thermally enhanced SOP
HSQ hydrogen-silsesquioxane
HSTL high speed transistor logic
HTC High Transmission Cavity
HTS High-Temperature Semiconductor
I2L integrated injection logic
IC integrated circuit
ICA Integrated Circuit Accumulator
IDT inter digital transducer
IGBT insulated gate bipolar transistor
IGT insulated gate transistor
IMIC I/O Interface Model for Integrated Circuits
ISB integrated system in board
JFET junction field-effect transistor
JLCC J-leaded chip carrier
KGD known good die
LCA Logic Cell Array
LCC leadless chip carrier
LCT light coupled transistor
LD laser diode
LDD lightly doped drain
LDMOS laterally diffused MOS
LED light emitting diode
LFLGA low profile fine pitch land grid array
LFSR linear feedback shift register
LGA land grid array
LOC lead on chip
LOCOS local oxidation of silicon
LQFP low profile quad flat package
LSI large scale integrated circuit
LSTTL low power Schottky transistor transistors logic
LVCMOS low voltage CMOS
LV-ECL low voltage-emitter coupled logic
LVTTL low voltage TTL
MAJC Microprocessor Architecture for Java Computing
MC-FBGA Multi Chip Fine pitch Ball Grid Array
MCM multi-chip module
MCP multi-chip package
MES FET metal semiconductor FET
MFP mini flat package
MIS metal insulator semiconductor
MLC multi-level cell
MMC MultiMediaCard
MMCP micro multi-chip package
MMIC microwave monolithic integrated circuit
MNOS metal nitride oxide semiconductor
MONOS metal oxide nitride oxide silicon
MOS metal oxide semiconductor
MOSFET metal oxide semiconductor field effect transistor
MQFP metric quad flat package
MQUAD metal quad
MRAM magnetic random access memory
MSI medium scale integrated circuit
MSOP micro small outline package
MSP mini square package
MSQ methyl-silsequioxane
MT-CMOS Multi-Threshold CMOS
nMOS n-channel metal oxide semiconductor
NROM Nitrided Read Only Memory
NTL non-threshold logic
NtRAM No Turnaround RAM
NVRAM non volatile random access memory
OAL OEM Abstraction Layer
ODP Over-Drive Processor
OEIC opto-electronic integrated circuit
OLA Open Library API
OLED Organic LED
OLGA organic land grid array
OMPAC over molded pad array carrier
OPamp operational amplifier
OPC organic photo conductor
OTP one time programmable ROM
OTPROM one time programmable ROM
OUM Ovonic Unified Memory
PAL Programmable Array Logic
PBGA plastic ball grid array
PC programmable controller
PDIP Plastic Dual-Inline Package
PECL positive emitter coupled logic
PECVD plasma-enhanced chemical-vapor deposition
PGA pin grid array
PLA programmable logic array
PLCC plastic leaded chip carrier
PLCC plastic leadless chip carrier
PLD programmable logic device
pMOS p-channel metal oxide semiconductor
PQFP plastic QFP
PROM programmable read only memory
PSGA plastic stud grid array
QDR Quad Data Rate
QFH quad flat high package
QFI quad flat I-leaded package
QFN quad flat high package
QFP quad flat package
QSOP Quarter Small-Outline Package
QTCP quad tape carrier package
QTP quad tape carrier package
QUIP quad in-line package
RAC macro cell with Rumbus interface
RAM random access memory
RAMDAC random access memory digital to analog converter
RCLED Resonant Cavity Light Emitting Diode
RET resolution enhancement technique
RLDRAM Reduced Latency DRAM
ROM read only memory
RPPDL regenerative push-pull differential logic
RRAM Resistance Random Access Memory
RTDs resonant-tunneling diodes
R-UIM Removable-User Identify Module
SBB Stud Bump Bonding
SBGA Super Ball-Grid Array
SCFL source coupled FET logic
SCR silicon controlled rectifier
SDA Secure Digital Association
SDIP shrink dual in-line package
SDRAM Synchronous DRAM
SGRAM Synchronous Graphics RAM
SHBT single heterojunction bipolar transistor
SHP surface horizontal package
SIL single in-line
SIM single in-line (memory) module
SIMM single in-line memory module
SIP single in-line package
SIP System In Package
SIT static induction transistor
SLDRAM next generation DRAM
SLSI super large scale integration
SLT solid logic technology
S-MCP Stacked Multi Chip Package
SMILE spherical micro integrated lens
SMP symmetrical multiprocessor
SMT simultaneous multithreading
SNB small outline nonleaded board package
SO small out-line
SOC system on chip
SO-DIMM small outline dual in-line memory module
SOI Small Out-line I-leaded package
SOI silicon on insulator
SOIC Small Outline Integrated Circuit
SOJ small outline J-leaded package
SON small outline non-leaded package
SOP small outline package
SOS silicon-on-sapphire
SOT Small Outline Transistor
SPDF Standard Parasitic (data) Exchange Format
SQFP shrink quad flat package
SRAM static random access memory
SRF stream receiver FIFO
SSD super Schottky diode
SSI small scale integrated circuit
SSIP shrink single in-line package
SSOP shrink small out-line package
SSTL stub series terminated transceiver logic
STF stream transmitter FIFO
STI shallow trench isolation
STTL Schottky transistor transistor logic
SVP surface vertical package
SZIP shrink zigzag in-line package
TAB tape-automated bonding
TBGA tape ball grid array
TCP tape carrier package
TFD thin film diode
T-LVTTL Terminated LVTTL
TPQFP test pad QFP
TQFP thin quad flat package
TSOC Thin Small-Outline C-lead
TSOP thin small out-line package
TSSOP thin shrink small out-line package
TTL transistor-transistor-logic
UCSP ultra chip scale package
ULSI ultra large scale IC
USIC user specific integrated circuit
UTSOP ultra thin small outline package
VCM Virtual Channel Memory
VCSEL Vertical Cavity Surface Emitting Laser
VCX Virtual Component Exchange
VDIP vertical dual in-line package
VFBGA very-thin fine-pitch ball grid array
VHSIC Very High Speed Integrated Circuit
VLSI very large scale integrated circuit
VMOS V-grooved metal oxide semiconductor
VQFP very small quad flat package
VRAM video random access memory
VRM variable regulator module
VS Variable Supply Voltage
VSMP vertical surface mount package
VSO very short pitch small out-line package
VSOP very small out-line package
VSRAM virtually-static random access memory
VTCMOS Variable Threshold voltage CMOS
WLCSP Wafer-Level Chip-Scale Package
ZBT zero bus latency
ZIF zero insertion force
ZIP zigzag in-line package[/spoil]
) выложит накопленную с годами информацию, глобализация производителей закончится. Хотябы в таком виде: 
Но что же так скромно, больше фантазии, -
